Remote-processing RPC-210 Instrukcja Użytkownika Pobierz pdf (Strona 53)

EXPANSION PORT & POWER BASIC SECTION 12

Page 12-2

No heat sink is necessary if power( P (MAX ) ) is less

than 1. 7W and the board operate s at 25°C. A rough rule

of thumb is you can draw 100 mA @5V from the board

and not require a heat sink.

There is a small heat sink on the RP C-210. U19 is

screwed to the board to get slightly better heat

dissipation. However, if you are going to operate the

heat sink at high temperatures (> 80°C) for extended

periods of time, it is advisable to add a heat sink.

If you expect to operate the board at high tempe ratures,

use the following formula to determine maximum power

dissipation:

P(MAX) = 125 - T

----------

Where: T

is ambient temperature.

Use a heat sink for a TO-220 IC. Suggested heat sink

types from Aavid are:

Aavid P/N Height P(max) @

50°C

P(max)

@ 50°C

577002B00000 0.25" 2.85 2.14

577102B00000 0.375 3.46 2.63

577202B00000 0.500 3.64 2.73

Other heat sink types and styles may be used depending

upon your mounting c onsidera tions. Heat dissipa tion is

greatly increased with air flow around the regulator.

Be sure to use silicone grease to increase heat flow. An

insulator is norma lly not necessar y unless you want to

keep the heat sink from shorting to an external case.

You may need to bend up U19 to attach the heat sink.

LOW POWER MODES

Low power modes are discussed in SECTION 7, REAL

TIME CLOC K, LOW POWER MODES.

Expansion Port Pin Out

J8 Pin Description

1 Data bus 0 line

2 External I/O select

3 Data bus 1 line

4 External power. Same as P1-E

5 Data bus 2 line

6 Interrupt 0

7 Data bus 3 line

8 Reset (active low)

9 Data bus 4 line

10 + 5V power

11 Data bus 5 line

12 Ground

13 Data bus 6 line

14 Ground

15 Data bus 7 line

16 Address line A4

17 Address line A0

18 + 5V power

19 Address line A1

20 Address line A5

21 Address line A2

22 No connection

23 Address line A3

24 ALE line

25 RD line (active low)

26 WR line (active low)

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